| 摘要 |
PROBLEM TO BE SOLVED: To prevent deviation in cleavage and cracks for improving reliability, and at the same time to obtain an excellent cleavage section in work for cleaving the material substrate along a scoring line. SOLUTION: In this device 3 for cleaving the material substrate, the material substrate 1 after going through a scribing process for forming the scoring lines 2, 2, etc., is cleaved along the scoring lines to separate the material substrate into individual sections. The device 3 has a vibration generation means 5 that generates vibration at a frequency suitable for characteristics in the quality of the material substrate, and a stress application means 5a that applies stress in a direction vertical or parallel to a surface where the scoring lines of the material substrate are added. Stress is applied from the front at a side where the scoring lines of the material substrate are formed by the vibration generation means or the rear surface, and at the same time the stress is applied by the stress application means, thus separating the material substrate into individual sections. |
