| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated-circuit device of a three- dimensional mounting structure which is of high reliability and whose production costs are low, and to provide its manufacturing method. SOLUTION: Interposers 14 in which IC chips 10 are fip-chip-mounted are laminated in a plurality of stages to constitute a memory module 28. Metal pins 30 as interlayer connecting members are inserted into through-holes, formed so as to be passed through the memory module 28, and they are electrically connected respectively to connecting lands at wiring layers 16 of the respective interposers 14 via solder pastes 26 filled into the through-holes. In the lowermost layer of the memory module 28, solder balls 32 are external connecting terminals are formed in the lower ends of the metal pins 30 as the interlayer connecting members.
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