发明名称 |
REINFORCED FLEXIBLE PRINTED BOARD AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING BOARD USING IT |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed board reinforced with as reinforcing plate which is not peeled off from the printed board even when a mounting component is soldered to the printed board after the printed board is left for at least five minutes at a room temperature. SOLUTION: The reinforcing plate is stuck to the flexible printed board with a photosetting adhesive which contains a polyester resin, a photo- cationically polymerizable compound, and a photo-cation copolymerizer and can be set with light.
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申请公布号 |
JP2002076527(A) |
申请公布日期 |
2002.03.15 |
申请号 |
JP20000259611 |
申请日期 |
2000.08.29 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
YAGI MOTOHIRO;HATAI MUNEHIRO;WATABE KOJI |
分类号 |
C09J163/00;C09J167/00;H05K1/02;H05K1/03;(IPC1-7):H05K1/02 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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