发明名称 REINFORCED FLEXIBLE PRINTED BOARD AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING BOARD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed board reinforced with as reinforcing plate which is not peeled off from the printed board even when a mounting component is soldered to the printed board after the printed board is left for at least five minutes at a room temperature. SOLUTION: The reinforcing plate is stuck to the flexible printed board with a photosetting adhesive which contains a polyester resin, a photo- cationically polymerizable compound, and a photo-cation copolymerizer and can be set with light.
申请公布号 JP2002076527(A) 申请公布日期 2002.03.15
申请号 JP20000259611 申请日期 2000.08.29
申请人 SEKISUI CHEM CO LTD 发明人 YAGI MOTOHIRO;HATAI MUNEHIRO;WATABE KOJI
分类号 C09J163/00;C09J167/00;H05K1/02;H05K1/03;(IPC1-7):H05K1/02 主分类号 C09J163/00
代理机构 代理人
主权项
地址