发明名称 METHOD AND DEVICE FOR COVERING AND FILLING BASE
摘要 PROBLEM TO BE SOLVED: To provide a method and device for covering and filling a base that can healthily cover and fill the inside of a recess formed on the surface of the base, and has a high deposit speed and at the same time the excellent utilization rate of a raw material. SOLUTION: This device has an ion source required for generating a particle beam (a hydrogen beam 29), a high-speed ion generation mechanism, and a raw material supply mechanism (a raw material container 23 and a carburetor 26) containing the element of a material for covering and filling the inside of the recess formed on the surface of a substrate Wf. The device also has a function for applying the particle beam to the base in parallel with the execution of a normal chemical gaseous phase deposition process and/or before the supply of a feed gas.
申请公布号 JP2002075912(A) 申请公布日期 2002.03.15
申请号 JP20000259459 申请日期 2000.08.29
申请人 EBARA CORP 发明人 KOGURE NAOAKI;HORIE KUNIAKI;ARAKI YUJI;NAGASAKA HIROSHI;SUMIYA MOMOKO
分类号 C23C16/48;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;(IPC1-7):H01L21/285;H01L21/320 主分类号 C23C16/48
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