| 摘要 |
PURPOSE: To solve the problem that a BGA semiconductor device has semiconductor elements mounted on a support board such as printed board, ceramic board, flexible board, etc., but these support boards are originally needless and an extra material, and the thickness of the support board enlarges the semiconductor device to result in a structure hard to radiate heat from semiconductor elements incorporated therein. CONSTITUTION: Conductive patterns 11A-11D are buried and formed in an insulation resin 10 with a conductive foil 20 half etched and formed. This reduces the thickness thereof enough. Radiating electrodes 11D are provided and hence a semiconductor device superior in heat radiation can be provided. |
