SEMICONDUCTOR CHIP WITH A PROTECTIVE COVERING AND ASSOCIATED PRODUCTION METHOD

摘要

The invention relates to a semiconductor chip having a protective layer (6,8) made of an abrasion-resistant and/or etch-resistant material applied thereto. The material can, for example, contain abrasion-resistant grains. In a preferred embodiment, the thickness of the semiconductor body (1) is reduced to less than 50 mu m. As a result, the chip inevitably breaks if an attempt is made to grind the hard protective layer. The wafer is pre-cut from the front side so that the chips can be individually separated in an easier manner, be provided with said protective layer (6), the thickness thereof being subsequently reduced from the rear side.