发明名称 IN SITU MICROENCAPSULATED ADHESIVE
摘要 <p>A novel adhesive formed in situ in a microcapsule and method for forming such a pressure sensitive of flowable adhesive in situ in a microcapsule is disclosed. The method for forming the novel adhesive comprises providing an aqueous mixture of wall material in water; adding a substantially water insoluble core material, free radical initiator, and a solvent for the pre-polymers to the aqueous mixture. The core material comprises a first addition polymerizable pre-polymer having a Tg of less than about 0 °C, a flash point of at least 75 °C, and a boiling point of at least 175 °C. These are typically selected from acrylate to methacrylate type materials. Optionally included is a second addition polymerizable pre-polymer for providing cross-linking or interaction between polymer chains. High shear agitation is provided to the aqueous mixture to achieve a particle size of about 0.1 to 250 microns. Stirring at a first temperature effects capsule wall formation; and heating to a second temperature polymerizes the pre-polymers of the core material for form an adhesive in situ in the formed capsules.</p>
申请公布号 WO2002020683(A2) 申请公布日期 2002.03.14
申请号 US2001027003 申请日期 2001.08.30
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