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发明名称
Bandförmiger Hoch-Tc-Multi-Filamentsupraleiter und Verfahren zu dessen Herstellung
摘要
申请公布号
DE59706211(D1)
申请公布日期
2002.03.14
申请号
DE19975006211
申请日期
1997.05.22
申请人
SIEMENS AG
发明人
RIES, DR.
分类号
H01L39/14;(IPC1-7):H01L39/14
主分类号
H01L39/14
代理机构
代理人
主权项
地址
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