摘要 |
Kit of adhesion agents for adhering substrates, wherein the kit comprises a plurality of reactive block copolymers of formula I: R<1> - (AB)m(A)n - R<2> wherein n = 0 or 1 and when n = 0, R<1> is different from, and reacts with R<2>, when n = 1, R<1> = R<2>, and wherein m = 1 or a whole number integer, and wherein each copolymer I has a molecular weight in the range 2000-20,000, A and B are blocks of repeating units selected from known thermoplastic resin types and are substantially immiscible and R<1> and R<2> comprise reactive and groups, wherein the block copolymers have order-disorder transition (ODT) at a temperature Tt in the range 10-75 DEG C corresponding to a desired range of adhesion application temperatures, and are liquid at a processing temperature Tp and solid at a service temperature Tt; kit of polymer resins of formula II and III for preparing a plurality of polymer resins of formula I; polymer resins for use therein; novel adhesion - release agents; compositions thereof; methods for the preparation thereof and for adhering or releasing substrates; a programmed computer and the use thereof in selection of agents. |
申请人 |
UNIVERSITY OF SHEFFIELD;RYAN, ANTHONY, JOHN;CROOK, COLIN, JAMES;FAIRCLOUGH, JOHN, PATRICK, ANTHONY;JONES, RICHARD, ANTHONY, LEWIS |
发明人 |
RYAN, ANTHONY, JOHN;CROOK, COLIN, JAMES;FAIRCLOUGH, JOHN, PATRICK, ANTHONY;JONES, RICHARD, ANTHONY, LEWIS |