| 摘要 |
<p>A method for fabricating optical devices comprises the steps of preparing a first substrate wafer (10) with at least one buried optical waveguide (15) on an approximately flat planar surface of the substrate and a second substrate wafer (20) with at least a second buried optical waveguide (25). The waveguides (15 and 25) so formed may be straight of be curved along the surface of the wafer or curved by burying the waveguide at varying depth along its length. The second wafer (20) is turned (flipped) and bonded to the first wafer (10) in such a manner that the waveguides (15 and 25), for example, may form an optical coupler or may crossover one another and be in proximate relationship along a region of each. As a result, three dimensional optical devices are formed avoiding conventional techniques of layering on a single substrate wafer. Optical crossover angles may be reduced, for example, to thirty degrees from ninety degrees saving substrate real estate.</p> |
