发明名称 |
No-flow flux adhesive compositions |
摘要 |
The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.
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申请公布号 |
US2002032280(A1) |
申请公布日期 |
2002.03.14 |
申请号 |
US20010888921 |
申请日期 |
2001.06.25 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
CHARLES SCOTT B.;KINNEY ROBERT J.;KROPP MICHAEL A.;MADER ROGER A. |
分类号 |
C08G59/42;C09J163/00;H01L21/56;(IPC1-7):C08F8/00 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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