| 摘要 |
A semiconductor device having a multilayer structure, wherein a first wafer unit used as a wafer base, other wafer units, and a circuit board are bonded in series through bumps formed on wafer unit surfaces, thereby to form a stacked-wafer-unit 3D structure. The structure makes the semiconductor device thinner, smaller in size and lighter in weight, and it can be manufactured and mass-produced by employing conventional equipment. |
