发明名称 |
Flip chip-in-leadframe package and process |
摘要 |
A method for connecting a chip to a leadframe includes forming bumps on a die by a Au stud-bumping technique, and attaching the chip to the leadframe by thermo-compression of the bumps onto bonding fingers of the leadframe. Also a flip chip-in-leadframe package is made according to the method. The package provides improved electrical performance particularly for devices used in RF applications. |
申请公布号 |
US2002031902(A1) |
申请公布日期 |
2002.03.14 |
申请号 |
US20010802443 |
申请日期 |
2001.03.09 |
申请人 |
PENDSE RAJENDRA D.;KARNEZOS MARCOS;BUSH WALTER A. |
发明人 |
PENDSE RAJENDRA D.;KARNEZOS MARCOS;BUSH WALTER A. |
分类号 |
H01L23/12;H01L21/603;H01L23/31;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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