发明名称 |
Packaging structure and method for automotive components |
摘要 |
The invention provides a packaging structure applied to an automotive component having semiconductors and electronic parts mounted on a ceramic base, characterized in that the semiconductors and electronic parts are partly or entirely sealed with a thixotropic silicone gel which has a thixotropy index of about 1.5-3.6 and a penetration depth of about 6-10 mm and a rate of change in viscosity of less than 10% of the initial value. |
申请公布号 |
US2002031672(A1) |
申请公布日期 |
2002.03.14 |
申请号 |
US20010823976 |
申请日期 |
2001.04.03 |
申请人 |
EGUCHI SHUJI;ASANO MASAHIKO;WATANABE MUTSUMI;NAKATSURU KUNITO;TOKUDA HIROATSU |
发明人 |
EGUCHI SHUJI;ASANO MASAHIKO;WATANABE MUTSUMI;NAKATSURU KUNITO;TOKUDA HIROATSU |
分类号 |
H01L23/29;H01L23/24;H01L23/31;H01L25/04;H01L25/18;H05K3/28;(IPC1-7):B32B9/04 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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