| 摘要 |
<p>A method for planarizing or polishing a substrate, particularly a memory or rigid disk, is provided. The method comprises abrading at least a portion of a surface of a substrate with a polishing system comprising (i) a polishing composition comprising a liquid carrier, at least one oxidized halide, and a at least one amino acid; and (ii) a polishing pad and/or an abrasive. The preferred polishing composition comprises 0.1-10 wt. % potassium iodate and 0.1-10 wt. % glycine, where the polishing composition has a pH of 2-5, and/or siica particles.</p> |
