| 摘要 |
A method for manufacturing a diffusion barrier layer over a substrate having a patterned copper layer. A refractory metal layer or a nitride layer of refractor metal is formed on the substrate and a top surface and a sidewall of the patterned copper layer. The refractory metal layer or the nitride layer of refractor metal is converted by HDP treatment into an implanted layer as a diffusion barrier layer, where gas of N2, O2, NH3, NO2, or N2O are used for producing implanting ions. A thermal process is performed to stabilize a diffusion barrier quality of the oxygen-containing implantation layer.
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