An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.
申请公布号
WO0221557(A1)
申请公布日期
2002.03.14
申请号
WO2000SG00133
申请日期
2000.09.06
申请人
OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG;INSTITUTE OF MATERIALS RESEARCH & ENGINEERING;GUENTHER, EWALD, KARL, MICHAEL;AUCH, MARK, DAI, JOONG
