发明名称 Substrate arranging apparatus and method
摘要 A substrate arranging apparatus has a carrier support table 40 for supporting thereon carriers C holding a plurality of wafers in arranged in a row, first support mechanisms 42, 43 capable of moving upward relative to the table 40 to support the wafers contained in the carriers C, and a second support mechanism 60 capable of supporting the even or the odd wafers among the wafers supported by the first support mechanisms 60 and of raising the wafers supported thereon relative to the rest of the wafers. The first support mechanisms 42, 43 or the second support mechanism is able to turn through an angle of 180° relative to the other. As a result, the wafer are arranged in a front-to-front and back-to-back disposition. Thus, the carrier support table, the loader mechanism and the substrate arranging section are integrally combined and the time needed for the transfer of the wafers is shortened.
申请公布号 US2002031421(A1) 申请公布日期 2002.03.14
申请号 US20010992374 申请日期 2001.11.16
申请人 TOKYO ELECTRON LIMITED 发明人 EGASHIRA KOUJI
分类号 B65G49/07;H01L21/304;H01L21/677;(IPC1-7):B65H1/00 主分类号 B65G49/07
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