| 摘要 |
To provide a contact structure of a lead in which a contract structure having a lead and a bump made of suitable metals, respectively, is formed easily and in which the bump and the lead are soundly connected together in terms of electricity and strength. A contact structure of a lead comprising a lead 12 formed by etching a conductive foil 11, a bump 5 formed by electric casting by means of plating, the bump 5 and the lead 12 being formed of different metals, respectively, the bump 5 being connected to a surface of the lead 12 through a conductive connecting material 10, the lead 12 being intimately contacted at a surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8, a basal portion of the bump 5 being forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 being fusion-adhered to an inner wall surface of the through-hole 17, and a distal portion of the bump 5 being projected from a second main surface 16 of the insulative sheet 8.
|
