发明名称 MOBILE PLATING SYSTEM AND METHOD
摘要 An exemplary mobile plating system and method are provided for performing a plating process using virtually any known or available deposition technology for coating or plating. The mobile plating system may include a vacuum chamber positioned in a mobile storage volume, an external vacuum pump, and a control module to control the operation of some or all of the operations of the external vacuum pump. The external vacuum pump is positioned in the mobile storage volume when the mobile plating system is in transit, and is positioned external to the mobile storage volume when the mobile plating system is stationary and in operation. The external vacuum pump may be mounted on a skid, and, in operation, the external vacuum pump couples with the vacuum chamber to assist with producing a desired pressure in the vacuum chamber. The external vacuum pump couples with the vacuum chamber using a flexible piping segment to reduce and/or eliminate any mechanical vibrations within the vacuum chamber and within the mobile storage volume due to the operation of the external vacuum pump. An exemplary method for using a mobile plating system is provided that includes locating the mobile plating system at a desired location for plating, positioning an external vacuum pump from an interior position of a mobile storage volume of the mobile plasma plating system to an exterior position, and coupling the external vacuum pump to a vacuum chamber within the mobile storage volume of the mobile plasma plating system using a flexible piping segment.
申请公布号 WO0190436(A3) 申请公布日期 2002.03.14
申请号 WO2001US16463 申请日期 2001.05.22
申请人 BASIC RESOURCES, INC.;KIDD, JERRY, D.;HARRINGTON, CRAIG, D.;HOPKINS, DANIEL, N., 发明人 KIDD, JERRY, D.;HARRINGTON, CRAIG, D.;HOPKINS, DANIEL, N.,
分类号 C23C14/24;C23C14/32;C23C14/34;C23C14/56;C23C16/44 主分类号 C23C14/24
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