发明名称 DRY ETCHING GAS AND METHOD FOR DRY ETCHING
摘要 A dry etching gas which comprises a compound having a CF3CF fragment directly bonded with a double bond (provided that the compound is exclusive of CF3CF=CFCF=CF2). Said dry etching gas permits the formation of a pattern such as a contact hole which has a high aspect ratio.
申请公布号 WO0221586(A1) 申请公布日期 2002.03.14
申请号 WO2001JP07678 申请日期 2001.09.05
申请人 DAIKIN INDUSTRIES, LTD.;HIROSE, MASATAKA;NAKAMURA, SHINGO;ITANO, MITSUSHI;AOYAMA, HIROKAZU 发明人 HIROSE, MASATAKA;NAKAMURA, SHINGO;ITANO, MITSUSHI;AOYAMA, HIROKAZU
分类号 H01L21/3105;H01L21/311;H01L21/768;(IPC1-7):H01L21/306 主分类号 H01L21/3105
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