SPIN COATER AND METHOD FOR REMOVING WAFER EDGE PHOTORESIST BY USING THE SAME

摘要

PURPOSE: A method for removing wafer edge photoresist is provided to make solvent from being splashed on the active region of a wafer and to eliminate a photoresist thin film formed in the flat zone of the wafer, by inserting the edge of the wafer into an incision groove so that the solvent is applied to the rotating wafer while a predetermined interval between the wafer and the incision groove is maintained. CONSTITUTION: A position detecting unit determines that a portion positioned inside the incision groove is the edge(11) or flat zone(13) of the wafer(10). If the portion is the flat zone of the wafer, the flat zone is transferred to the inside of the incision groove by a transfer apparatus. Photoresist(12) applied in the flat zone is eliminated by the solvent.