发明名称 |
Multilayered board and method for fabricating the same |
摘要 |
A multilayered board includes a laminate including a plurality of glass-containing insulating layers, each glass-containing insulating layer being provided with an electrode on the surface thereof. The glass-containing insulating layer is formed by firing a layer containing 60% by volume or less of a glass component before firing, a portion of the glass component is segregated in the surface region of the glass-containing insulating layer by firing, and the electrode is bonded to the surface of the glass-containing insulating layer by means of the segregated glass component. A method for fabricating a multilayered board is also disclosed.
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申请公布号 |
US2002029838(A1) |
申请公布日期 |
2002.03.14 |
申请号 |
US20010906016 |
申请日期 |
2001.07.11 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KAWAKAMI HIROMICHI |
分类号 |
H05K1/09;H01L23/15;H01L23/498;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):C03B29/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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