| 摘要 |
<p>A delamination resistant electronics module assembly (10) includes a printed circuit board (PCB) layer (60) coupled to a pallet (20) via a cured epoxy preform (40). The preform (40) may include conductive epoxy, or non-conductive epoxy with conductive traces. Component wells (80, 82) are collectively formed by the preform (40) and PCB layer (60) for placement of heat generating components (84), such as RF components. Methods of manufacturing module assemblies (10) include curing the epoxy preform (40) by applying a predetermined elevated pressure and heat to a sub-assembly of the pallet (20), preform layer (40), and PCB layer (60).</p> |
