Manufacturing method of a metal-ceramic circuit board

摘要

A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate (7) of aluminum or aluminum alloy at least one of ceramic substrate boards (2) having a conductive metal member (3) for an electronic circuit. A method of manufacturing a metal-ceramic circuit board is characterized by comprising the steps of melting aluminum or aluminum alloy in a vacuum or inert gas atmosphere to form a molten metal (13), contacting one surface of a ceramic substrate board (2) directly with the molten metal (13) in a vacuum or inert gas atmosphere, cooling the molten metal (13) and the ceramic substrate board (2) to form a base plate (7) of aluminum or aluminum alloy, which is bonded directly on the ceramic substrate board (2) without forming any oxidizing film therebetween and bonding a conductive metal member (3) for an electronic circuit on the ceramic substrate board (2) by using a brazing material (4). The base plate (7) has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1mm.