| 摘要 |
During the mounting of a semiconductor chip (1) on a substrate with a portion of adhesive (5), a bonding head (3) is lowered at a pre-defined height (H) over a support (6) holding the substrate. A gripper (2) is fixed on the bonding head in an upper end position. As soon as the bonding head reaches the height, the gripper is released to move down and press the chip onto the adhesive. After a preset time the bonding head lifts up after loosening the gripper. |
