发明名称 |
Circuit device and method of manufacturing the same |
摘要 |
After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the insulating resin 50 as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths 51 and the circuit elements 52 supported by the insulating resin 50 can be produced without employing the support substrate. <IMAGE> |
申请公布号 |
EP1187204(A2) |
申请公布日期 |
2002.03.13 |
申请号 |
EP20010302580 |
申请日期 |
2001.03.20 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
SAKAMOTO, NORIAKI;KOBAYASHI, YOSHIYUKI;SAKAMOTO, JUNJI;MASHIMO, SHIGEAKI;OKAWA, KATSUMI;MAEHARA, EIJU;TAKAHASHI, KOUJI;FUKUDA, HIROKAZU;ETOU, HIROKI |
分类号 |
H01L21/48;H01L23/31;H01L23/495;H05K1/18;H05K3/06 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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