| 摘要 |
The method involves producing software, installing the software on a chip and applying chip-carrier related and user-related personalization data to the chip. The chip-carrier related data are applied to the chip and the user-related personalization data are applied separately in a later production step. Independent claims are also included for the following: an arrangement for testing wafers, an arrangement for manufacturing chip modules, an arrangement for testing chip modules, an arrangement for embedding chip modules in a carrier and an arrangement for personalizing chips embedded in a carrier. |
