| 摘要 |
<p>A heat curable thermosetting epoxy resin formulation useful for making prepregs and electrical laminates containing a viscosity modifier, wherein the viscosity modifier is:(a) an optionally substituted polymer of a monovinylidene aromatic monomer, optionally having one or more further unsaturated monomers copolymerized therewith;(b) an optionally substituted polyphenylene oxide; or(c) an oxazolidone ring-containing compound.</p> |
