发明名称 Connector-mounted substrate and method for assembling the same
摘要 A method of surface-mounting a connector on a circuit board using a rivet as a mounting member is provided. This method can provide an excellent assembling process by, if necessary, using the conventional solder dipping process or rivet caulking process. A rivet has a middle portion acting as a flange. In the rivet, one end is previously fixed to a connector side while the other end is inserted into a first hole formed in the surface of a circuit board, so that the flange can be closely attached to the circuit board. Particularly, since a soldering pad is formed adjacent to a hole formed in the circuit board, the rivet can be bonded to the circuit board while other electronic components are being surface-soldered on the circuit board.
申请公布号 US6354871(B1) 申请公布日期 2002.03.12
申请号 US19990267680 申请日期 1999.03.15
申请人 NEC CORPORATION 发明人 HATAKEYAMA KENICHI
分类号 F16B5/04;F16B19/06;F16B19/08;H01R13/73;H05K1/18;(IPC1-7):H01R13/73 主分类号 F16B5/04
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