| 摘要 |
An apparatus to induce very small bubbles of gas into a stream of deionized water without allowing large bubbles to be entrained is disclosed for use in Chemical Mechanical Polishing for semiconductor manufacture. The apparatus includes a cylinder possessing a central axis positioned vertically, a gas inlet, a deionized water inlet positioned essentially above the gas inlet, a deionized water with gas outlet positioned essentially above the deionized water inlet and a vent outlet positioned essentially above the deionized water with gas outlet. The apparatus introduces an essentially gaseous composition into the cylinder through the gas inlet into deionized water in the cylinder. The gas travels through the deionized water inlet to a level in the cylinder above the position of the deionized water with gas outlet, wherein the gaseous composition is further constrained to enter as bubbles with a predetermined size range in the deionized water through the deionized water inlet.
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