发明名称 POSITIVE TYPE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a positive type resist composition having excellent resolution and etching resistance, capable of giving a resist pattern that undergoes a small dimensional change per unit temperature by a thermal flow process and having good aging stability. SOLUTION: The positive type resist composition contains (A) a base resin component comprising at least one hydroxystyrene copolymer having an acid dissociable group substituted for the hydrogen atom of at least part of phenolic hydroxyl groups or carboxyl groups present in the copolymer, (B) a compound which generates an acid when irradiated with radiation, (C) a crosslinkable polyvinyl ether compound, (D) a carboxylic acid consisting only of carbon, oxygen and hydrogen atoms and (E) an organic amine.
申请公布号 JP2002072480(A) 申请公布日期 2002.03.12
申请号 JP20000264529 申请日期 2000.08.31
申请人 TOKYO OHKA KOGYO CO LTD 发明人 NITTA KAZUYUKI;SATO KAZUFUMI;KAWANA DAISUKE;SHIMATANI SATOSHI
分类号 G03F7/039;C08F2/44;C08F257/00;C08K5/00;C08K5/09;C08K5/17;C08L25/18;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/039
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