发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring both a high film leaving property and high sensitivity in practical use independently of the amount of a quinonediazidodiazido-containing photosensitive agent used, excellent also in suitability to coating and uniformity in the line width of a resist pattern, having low process dependence and capable of forming a good pattern. SOLUTION: In the photosensitive resin composition containing an alkali- soluble resin and a quinonediazidodiazido-containing photosensitive agent, a mixture of a novolak resin having a weight average molecular weight (expressed in terms of polystyrene) of 3,000-15,000 and a styrene resin having a weight average molecular weight (expressed in terms of polystyrene) of 3,000-25,000 is used as the alkali-soluble resin.
申请公布号 JP2002072473(A) 申请公布日期 2002.03.12
申请号 JP20000255215 申请日期 2000.08.25
申请人 CLARIANT (JAPAN) KK 发明人 TAKAHASHI SHUICHI
分类号 G03F7/032;C08K5/13;C08K5/42;C08L61/06;G03F7/004;G03F7/022 主分类号 G03F7/032
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