发明名称 Composite polishing pad
摘要 A composite polishing pad. A lower polishing pad is concentrically disposed on a turning table. The lower polishing pad has a same radius of the turning pad. A handler is installed at a periphery of the lower polishing pad to advantage a renewal process. An upper polishing pad is disposed on the lower polishing pad, again, concentrically to the turning table. The upper polishing pad has a radius between a covering range of polishing dresser (conditioner) and a covering range of a top ring. Therefore, while initiating, the projecting portions are not formed on the composite polishing pad, so that the manually notching step is skipped.
申请公布号 US6354925(B1) 申请公布日期 2002.03.12
申请号 US19990393982 申请日期 1999.09.10
申请人 WINBOND ELECTRONICS CORP. 发明人 CHOU LIANG-KUEI;LI CHI-HONE;HUANG CHII-YEH
分类号 B24B37/04;B24D13/14;(IPC1-7):B24B7/00 主分类号 B24B37/04
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