发明名称 Placement system apparatus and method
摘要 An apparatus and a method are disclosed for placing at least two elements on a surface. The apparatus comprises means for supplying a surface, means for transferring the two elements to the surface, means for adjusting the position of the surface in a first direction, and means for adjusting the position of the transferring means in a second direction and about a rotation axis parallel to a third direction, the first, second and third directions being mutually orthogonal. Recognizing means are provided on at least one of the transferring means for recognizing position alignment marks provided on the surface.
申请公布号 US6355298(B1) 申请公布日期 2002.03.12
申请号 US19990379309 申请日期 1999.08.23
申请人 ASM ASSEMBLY AUTOMATION LTD. 发明人 WAH CHENG CHI;ON ALFRED YUE KA;FAI WONG CHIU
分类号 H05K3/34;B23K37/04;B25J13/08;H01L23/12;(IPC1-7):B05D1/36 主分类号 H05K3/34
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