发明名称 |
Method of making mechanical-laser structure |
摘要 |
A mechanical-laser structure on a printed circuit board and a carrier. A method for fabricating the mechanical-laser structure includes the following steps. A substrate is provided. A first through hole is formed in the substrate by mechanical drilling. An epoxy plug is formed within the first through hole. A conductive layer is formed on the substrate by compression. The conductive layer is patterned to form conducting wires and exposes the epoxy plug. A micro via is formed within the epoxy plug by laser drilling.
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申请公布号 |
US6353999(B1) |
申请公布日期 |
2002.03.12 |
申请号 |
US19990306340 |
申请日期 |
1999.05.06 |
申请人 |
UNIMICRON TAIWAN CORP. |
发明人 |
CHENG DAVID C. H. |
分类号 |
B23K26/00;B23K26/38;B23K101/42;H05K1/11;H05K3/00;H05K3/40;H05K3/42;(IPC1-7):H01K3/10 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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