Passivation of inlaid metallization

摘要

A method for forming a metal interconnect having a self-aligned transition metal-nitride barrier (124). After the metal interconnect lines (118) are formed, a transition metal (120) is deposited over the surface of the metal interconnect lines (118) and reacted in to form a metal-compound (122). The metal-compound (122) is then annealed in a nitrogen ambient to form a barrier layer (114) at the surface of the metal interconnect lines (118).