发明名称 |
POLYAMIDE RESIN COMPOSITION |
摘要 |
A polyamide resin composition is provided, which contains 100 parts by weight of a polyamide resin (A) that has dicarboxylic acid units (a) containing from 60 to 100 mol% of terephthalic acid units and diamine units (b) containing from 60 to 100 mol% of C6-18 aliphatic alkylenediamine units, and from 1 to 100 parts by weight of a polybromostyrene (B), in which from 0.5 to 100 % by weight of the polybromostyrene (B) is a polybromostyrene having an epoxy group. The polyamide resin composition has good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.
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申请公布号 |
CA2357105(A1) |
申请公布日期 |
2002.03.12 |
申请号 |
CA20012357105 |
申请日期 |
2001.09.10 |
申请人 |
KURARAY CO., LTD. |
发明人 |
SASAKI, SHIGERU;OKA, HIDEAKI;MATSUOKA, HIDEHARU |
分类号 |
C08L25/18;C08L77/00;C08L77/02;C08L77/06;(IPC1-7):C08L77/06 |
主分类号 |
C08L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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