| 摘要 |
PURPOSE: To provide a semiconductor device and its manufacturing method, and a circuit board and an electronic equipment capable of improving the production yield of packaging to the circuit board of a stacked semiconductor device. CONSTITUTION: The semiconductor device comprises a plurality of chips 10 and a plurality of substrates 20 having chips 10 mounted on either thereof in a configuration larger than the chip size. The respective substrates 20 are stacked, and a pair of substrates 20 have first terminals 40, 41 disposed outer than the chip 10 and are connected thereto, resulting in electrically connecting the chips 10 vertically disposed on the respective substrates. On the lowermost substrate, second terminals 50 are disposed inner than the first terminals 40, 41. The second terminals are connected to either one of the semiconductor chips 10. Pitches between adjoining second terminals 50 are configured wider than those of the first terminals 40, 41. |
