摘要 |
PURPOSE: Provided is a device for isolating at least one electrical or electronic element integrated on a semiconductor substrate. CONSTITUTION: In order to isolate at least one electrical or electronic element(16,58), such as an interconnecting part integrated on a semiconductor substrate(12), the device has an assembly which has at least one isolating unit which is selected from among isolating layers(84,86,90), extending inside the substrate and at least two layered conductors(60,62,64,66,68,70), whose height exceeds that of the element and which are integrated inside the substrate and extend along the element on both sides of the element. |