发明名称 TRANSFER DEVICE FOR FABRICATING SEMICONDUCTOR DEVICE
摘要 PURPOSE: A transfer device for fabricating a semiconductor device is provided to minimize generation of pollutants including particles due to a transfer device. CONSTITUTION: A transfer portion(12) is used for loading and transferring a multitude of substrate(10). A slot(14) is used for separating and loading the substrates(10) from the transfer portion(12). 29 substrates are loaded in the transfer portion(12). Accordingly, the number of the slot(14) becomes 29. The transfer portion(12) includes an elevator for transferring the substrates(10). A transferring operation of the transfer portion(12) is performed by using a drive member including a wire and a motor or a drive member including a rail and a motor. An adhesion portion(16) is formed in the slot(14). The adhesion portion(16) is contacted with the substrate(10) when the substrates(10) are loaded on the transferring portion(12).
申请公布号 KR20020019169(A) 申请公布日期 2002.03.12
申请号 KR20000052302 申请日期 2000.09.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, NAM HEON
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
代理机构 代理人
主权项
地址