SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to realize integration by stacking semiconductor chip in a semiconductor package of a thickness similar to that of the chip, and to maximize a heat radiation capacity by making a surface of the semiconductor chip exposed to the outside or additionally attaching a heat sink to the exposed semiconductor chip. CONSTITUTION: A base(12) has a predetermined area. The center portion of the base is penetrated. A lead frame(14) is attached to a surface of the base by an adhesive unit(26). A surface of the lead frame is etched by a half-etching process. A plurality of semiconductor chips are stacked on the central penetration part of the base. A wire(20) connects a bonding region of the lead frame with a bonding pad of the semiconductor chip. The semiconductor chip and the wire except a ball land(16) of the lead frame seemingly protruding by the half-etching process and a surface of the uppermost semiconductor chip are molded by resin(18).