SPUTTERING APPARATUS FOR FABRICATING SEMICONDUCTOR

摘要

PURPOSE: A sputtering apparatus for fabricating a semiconductor is provided to minimize a stack of contaminant including particles in performing a process for forming a layer using a target, by minimizing particles existing in the target. CONSTITUTION: A substrate is placed on a plate. The target(14) is made of the same material as a material to be stacked on the substrate. The corner portion(140c) at the end of the target is made round. The target is installed in the upper portion of a process chamber, and the plate is received in the lower portion of the process chamber. Particles having high energy collides against the target to stack the material separated from the target on the substrate.