| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass ceramic sintered compact which can be fired together with a high-thermal-expansion glass ceramic sintered compact and has high dielectric constant and low tanδ and to provide a wiring board having a built-in capacitor and excellent in reliability when mounted in a printed board where an organic resin is used as an insulating material. SOLUTION: This glass ceramic sintered compact consists of 50-70 volume % glass component having 6-18×10-6/ deg.C coefficient of thermal expansion at 40-400 deg.C and 30-50 volume % filler component containing lanthanum titanate, magnesium titanate, another titanate and zirconium-containing oxide and has 8×10-6/ deg.C or larger coefficient of thermal expansion at 40-400 deg.C, 14 or larger relative permittivity at 1 MHz to 3 GHz and 25×10-4 or smaller tanδ at 1 MHz to 3 GHz. The glass ceramic sintered compact is used as at least one layer 1b of the internal layers of a multi-layered wiring board 1, metallized electrodes 3 are formed on the upper and lower sides of the layer 1b and the capacitor is built in the board 1. |
