| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an epoxy resin composition for sealing a semiconductor wherein pigment particle aggregation is prevented without degrading releasing and flowing characteristics. SOLUTION: In a method for manufacturing an epoxy resin composition for sealing semiconductors by heating and kneading an epoxy resin, a curing agent, an inorganic filler, a pigment, a demolding agent and a curing accelerator, the epoxy resin, the curing agent, the inorganic filler and the pigment are heated and kneaded with a continuous kneader having a screw pitch of <=1.0 as a previous treatment, and then the demolding agent and the curing accelerator are blended with the mixture and are subjected further to heating and kneading with a continuous kneader having a screw pitch of >=1.0.
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