| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which guarantees long term reliability without causing a resin cracking, and which is excellent in moisture resistance after mounting or soldering heat resistance, adhesiveness when mounted, while hygroscopicity is low, fluidity is good and moldability is excellent. SOLUTION: This epoxy resin composition containes a phenol compound shown by formula (A), a phenol compound show by formula (B), an epoxy resin shown by formula (C), an inorganic filler and a curing accelerator as essential components and is characterized by including the inorganic filler at 80-85 wt.% of a rate to the resin composition, and the semiconductor sealing device which is sealed by this curing material is provided.
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