ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: To suppress an inclination of a semiconductor chip to a main surface of a circuit board. CONSTITUTION: This electronic device comprises a semiconductor chip having plural electrode pads on its main surface, a circuit board having plural connecting parts on the main surface, and plural projecting electrodes arranged between each of the electrode pads of the semiconductor chip and each of the connecting parts of the circuit board in order to electrically connect each other. These plural projecting electrodes are positioned in the manner that the semiconductor chip is in unbalanced arrangement to the main surface of the circuit board. The plural connecting parts are placed at a deeper position than that of the main surface of the circuit board in the depth direction.