发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a modified silicone based curable resin composition having good storage stability and excellent internal curability. SOLUTION: The curable resin composition comprises (A) a silicone based resin having a polyoxyalkylene as the main chain and a silicon group in which two alkoxyl groups and one hydrocarbon group are directly bonded to the silicon atom and (D) a polymerization product to be obtained by polymerizing (C) a polymerizable vinyl group-containing monomer in (B) a silicone based resin having a polyoxyalkylene as the main chain and a silicon group in which three alkoxyl groups are directly bonded to the silicon atom as the effective components at a content ratio of the silicone based resin (A) to the polymerization product (D) of 30-99 mass%: 70-1 mass%.
申请公布号 JP2002069289(A) 申请公布日期 2002.03.08
申请号 JP20000263095 申请日期 2000.08.31
申请人 KONISHI CO LTD 发明人 SATO AKIHIRO;SATO SHINICHI
分类号 C08L71/02;C08F283/06;C08G65/336;C08L51/08;(IPC1-7):C08L71/02 主分类号 C08L71/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利