| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating equipment which automatically dips an anode in an appropriate condition into a plating solution, without necessity of disassembling a plating vessel for maintenance and replacement of an anode, and a method for manufacturing a semiconductor device. SOLUTION: The equipment comprises an anode supplying mechanism for supplying the anode into the plating solution, in order to keep the surface area of the anode contacting with the plating solution in the predetermined value or more. The mechanism supplies the plating solution, to a part of the anode which does not contact with the plating solution, so as to contact with the plating solution in the plating vessel according to the reduction in the surface area, in order to keep the surface area in the predetermined value or more, according to a principle that the surface area is the interface of the anode with the plating solution. The equipment also comprises a detecting mechanism for detecting the surface area of the anode by estimation, which contacts with the plating solution. The mechanism detects the surface area of the anode by estimation, which contacts with the plating solution, and supplies the anode as above by using this result.
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