| 摘要 |
PURPOSE: A baking apparatus used in fabricating a semiconductor is provided to increase operation efficiency by eliminating contaminant by a sensing process without using a periodical method, and to improve reliability by minimizing the contaminant absorbed to a substrate. CONSTITUTION: A substrate to be heated to a predetermined temperature is placed on a lower plate(14), installed under a case(10). A pin(16) supports the substrate placed on the lower plate, penetrating the lower plate. An upper plate(12) is installed in an upper portion confronting the lower plate in the case. A sensing unit(30) senses that the contaminant generated in heating the substrate to a predetermined temperature is absorbed to the inside of the case including the lower and upper plates, installed in the lower and upper plates, respectively.
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